Ultrafuse PA is suitable for a wide range of applications working within a larger temperature range than normal PA filament. BASF\u2018s Ultramid\u00ae grades are molding compounds on the basis of PA6, PA66 and various co-polyamides such as PA6\/66.<\/p>\n
Ultramid\u00ae is noted for its high mechanical strength, stiffness and thermal stability.<\/p>\n
In addition, Ultramid\u00ae offers good toughness at low temperatures. Owing to its excellent properties, this material has become indispensable in almost all sectors of engineering for a wide range of different components and machine elements, as a high-grade electrical insulation material and for many special applications.<\/p>\n
Ultrafuse PA is the translation of BASF\u00b4s Ultramid\u00ae to 3D printing space.<\/p>\n
With Ultrafuse PA, it is possible to print semi-flexible thin parts, however it is very stiff in higher thicknesses. It has a lower melting temperature than PA6 and PA66 hence it can be printed in a lower temperature as well as it has better impact strength against PA6 and PA66 which opens up a new application field to the end-users. Depending on specific requirements, the formulation can be optimized further, and special filaments can be created.<\/p>\n
\u2022\tGood fatigue resistance<\/p>\n
\u2022\tLow melting point makes it printable for many FFF printers<\/p>\n
\u2022\tGood wear resistance\/lubricity<\/p>\n
You can see the TDS here.<\/a><\/p>\n